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IPC 9261 : A

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS

Available format(s)

Hardcopy

Superseded date

09-12-2023

Language(s)

English

1 OVERVIEW
  1.1 Scope
  1.2 Purpose
  1.3 Terms and Definitions
      1.3.1 DPMO (Defects per Million Opportunities)
      1.3.2 DPU (Defects per Unit)
      1.3.3 Process Step Estimated Yield
      1.3.4 Component Opportunities (o[c])
      1.3.5 Component Defect (d[c])
      1.3.6 Placement Opportunity (o[p])
      1.3.7 Placement Defect (d[p])
      1.3.8 Termination Opportunity (o[t])
      1.3.9 Termination Defect (d[t])
      1.3.10 Assembly Opportunity (o[a])
      1.3.11 Assembly Defect (d[a])
2 APPLICABLE DOCUMENTS
3 CALCULATION OF IN-PROCESS METRICS
  3.1 Calculation of In-Process Metrics - Assumptions
  3.2 Calculation Examples
  3.3 Calculation of Placement DPMO
  3.4 Calculation of Termination DPMO
  3.5 Calculation of Component DPMO
  3.6 Calculation of Assembly DPMO
4 ESTIMATED YIELD
Appendix A: Defect Classification

Defines standard methodologies for calculating defects per million opportunities (DPMO) metrics related to electronic printed board assembly processes.

Committee
5-20
DocumentType
Standard
Pages
24
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
IPC 7912 : A END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES
IPC DPMO 202 : 2002 IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET
IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 9199 : 0 STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 1720 : A2004 ASSEMBLY QUALIFICATION PROFILE
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC DPMO 202 : 2002 IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
IPC 7912 : A END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES

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US$124.60
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