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IPC 9501 : 0

Current
Current

The latest, up-to-date edition.

PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
Available format(s)

Hardcopy

Language(s)

English

Published date

07-01-1995

1.0 SCOPE
2.0 APPLICABLE DOCUMENTS
2.1 Institute for Interconnecting and Packaging
     Electronic Circuits (IPC)
2.2 Joint Industry Standards
2.3 Electronic Industries Association
2.4 Military
3.0 TERMS AND DEFINITIONS
4.0 APPLICATIONS AND OBJECTIVES
5.0 APPARATUS
6.0 REQUIREMENTS
7.0 RECOMMENDATIONS
8.0 COMPONENT CLASSIFICATION
9.0 COMPONENT PROCESS PRECONDITIONING PROCEDURES
9.1 Moisture Preconditioning
9.2 Component Mounting
9.3 First Soldering Process Exposure
9.4 Aliphatic or Terpene Hydrocarbon Cleaning
9.5 Second Soldering Process Exposure
9.6 Water Soluble Flux Exposure
9.7 Third Soldering Process Exposure
9.8 Aqueous Detergent/DI Water Total Immersion Cleaning
10.1 Moisture Exposure
10.2 Component Mounting
10.3 Soldering Process Exposure
10.4 Chemical Exposure
10.5 Criteria
11.0 SOLDERING PROCESS COMPATIBILITY MATRIX

Specifies manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes.

DocumentType
Standard
Pages
79
PublisherName
Institute of Printed Circuits
Status
Current

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