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IPC 9503 : 0

IPC 9503 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS

Available format(s)

Hardcopy

Superseded date

08-01-2008

Language(s)

English

Publisher

Institute of Printed Circuits

1 GENERAL
   1.1 Scope
   1.2 Background
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 Joint Industry Standards
   2.3 Electronic Industries Association
3 APPARATUS
4 CLASSIFICATION/RECLASSIFICATION
5 PROCEDURE
6 CRITERIA
7 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION
8 OPTIONAL WEIGHT GAIN/LOSS ANALYSIS
9 ADDITIONS AND EXCEPTIONS
Figures
Figure 1 Flow Chart
Tables
Table 1 Package Reflow Conditions
Table 2 Moisture Sensitivity Levels
Table 3 Classification Reflow Profiles

This standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly stored, packaged, and handled to avoid subsequent mechanical/thermal damage during the assembly solder reflow attachment and/or repair operation. The standard may be used to determine what classification level should be used for initial reliability qualification.

DevelopmentNote
Included in IPC M 109 & IPC E 500. (09/2003) Also available in CD-ROM format. (09/2005)
DocumentType
Standard
Pages
19
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 9501 : 0 PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC 9500 : 2003 ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE
IPC 9504 : 0 ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
IPC 9502 : 0 PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IPC M 109 : LATEST COMPONENTS HANDLING MANUAL
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

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Hardcopy - English

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