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IPC 9631 : 0

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION
Available format(s)

Hardcopy

Superseded date

05-15-2016

Language(s)

English

Publisher

Institute of Printed Circuits

1 EXECUTIVE SUMMARY
2 APPLICABLE DOCUMENTS
3 HISTORICAL BACKGROUND
4 PRECONDITIONING CONSIDERATIONS
5 PROFILE DEVELOPMENT/OVEN SETUP
6 PROFILE VERIFICATION
7 PHYSICS OF METHOD 2.6.27
8 SUMMARY

Specifies how the test method is intended for use and the rationale behind some of the protocols and requirements.

DevelopmentNote
Included in IPC C 1000. (12/2010) Also available in German Language, See IPC 9631 GERMAN. (04/2013)
DocumentType
Standard
Pages
24
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
IPC TM 650 : 0 TEST METHODS MANUAL
IPC 7530 : 0 GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES

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