IPC CM 770 : E
Current
The latest, up-to-date edition.
Hardcopy
English
01-01-2004
1 SCOPE
1.1 Purpose
1.2 Classification of Board Types and Assemblies
1.3 Order of Precedence
1.4 Presentation
1.5 Terms and Definitions
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
2.3 Electronic Industries Association
2.4 EOS/ESD Association Documents
2.5 JEDEC
3 GENERAL GUIDELINES
3.1 Design Options and Considerations
3.2 Assembly Considerations
3.3 Materials
3.4 Handling and Storage
3.5 Material Movement Systems
4 COMPONENT GUIDELINES
4.1 Component Characterization and Classes
4.2 Component Packaging/Delivery Systems
4.3 Lead/Termination Finishes
5 PACKAGING AND INTERCONNECTING (PRINTED BOARD) STRUCTURES
5.1 Printed Board Characterization and Classes
5.2 Supporting-Plane Printed Board Structures
5.3 Constraining Core Printed Board Structures
5.4 Other Mounting Structure Materials and Considerations
6 ASSEMBLY DESIGN CYCLE
6.1 Types of Assembly Operations
6.2 Soldering Operations
6.3 Assembly Sequence
6.4 Mass Attachment Properties
6.5 Environment (Nitrogen)
7 PLACEMENT GUIDELINES
7.1 Placement Technology
7.2 Design Checks
7.3 Specification and Procurement of Components
7.4 Specification and Procurement of Printed Boards
7.5 Specifications and Procurement of Process Materials
8 INTERCONNECT TECHNOLOGY
8.1 Component Spacing
8.2 Single and Double-Sided Board Assembly
8.3 Component Standoff Height for Cleaning
8.4 Fiducial Marks
8.5 Conductors
8.6 Via Guidelines
8.7 Standard Fabrication Allowances
8.8 Board Size and Panelization
9 COMPONENT CHARACTERISTICS THROUGH-HOLE
9.1 Axial-Leaded Discrete Components
9.2 Radial-Leaded Discrete Components
9.3 Multiple-Radial-Lead Components
9.4 Inline Packages
9.5 Ribbon-Lead Components
9.6 Pin Grid Array Components
9.7 Through-Hole Mount Connectors
9.8 Through-Hole Sockets
10 MOUNTING STRUCTURE REQUIREMENTS THROUGH-HOLE
10.1 Printed Board Characterization and Types
11 ASSEMBLY SEQUENCE THROUGH-HOLE
11.1 Process Steps
11.2 Component Placement
11.3 Vertical Mounting
11.4 Mixed Technology
11.5 Manual Techniques
11.6 Automated Techniques
12 COMPONENT CHARACTERISTICS SURFACE MOUNT
12.1 Characterization and Classes
12.2 Component Procurement
12.3 Handling and Storage
12.4 Chip Resistors
12.5 Chip Capacitors
12.6 Inductors
12.7 Tantalum Capacitors
12.8 Metal Electrode Face (MELF) Components
12.9 SOT 23
12.10 SOT 89
12.11 SOD 123
12.12 SOT 143
12.13 SOT 223
12.14 TO 252/TO 268
12.15 SOIC
12.16 SOP
12.17 SOJ
12.18 PLCC (Square)
12.19 PLCC (Rectangular)
12.20 LCC
13 MOUNTING STRUCTURE GUIDELINES SURFACE MOUNT
13.1 Printed Board Characterization and Types
13.2 Organic Rigid, Organic Flex and Rigid-Flex
13.3 Land Patterns
13.4 Tolerance Analysis
13.5 Alternative Printed Board Structures
13.6 Surface Preparation
13.7 Gold on Printed Board Surface Mount Lands
13.8 Printed Board Condition
14 SURFACE MOUNT
14.1 Assembly Hierarchy
14.2 Manual Techniques
14.3 Automated Assembly Techniques
15 COMPONENT CHARACTERISTICS HIGH PIN COUNT AREA ARRAY
15.1 Component Definition
15.2 Component Packaging Style Considerations
15.3 BGA Connectors
15.4 Components Package Drawings
15.5 Component Procurement
15.6 Handling and Storage
16 MOUNTING STRUCTURE REQUIREMENTS HIGH PIN COUNT AREA ARRAY
16.1 Characterization and Classes - Interconnecting
Structures (Printed Boards)
16.2 Standardization
16.3 Ball Pitch
16.4 Future Ball Conditions
16.5 Land Approximation
16.6 Physical Conditions
17 ASSEMBLY HIERARCHY HIGH PIN COUNT AREA ARRAY
17.1 Process Steps
17.2 Process Step Analysis
17.3 Attachment Issues
17.4 Reflow
17.5 Preclad
18 COMPONENT CHARACTERISTICS FLIP CHIP DIRECT CHIP ATTACH
18.1 Types of Flip Chip Joints
18.2 Characterization and Classes of Flip Chip Joints
18.3 Component Design for Circuit Boards
18.4 Handling, Shipping and Storage
18.5 Mechanical Properties
18.6 Electrical Issues
18.7 Marking
18.8 Physical Conditions
19 MOUNTING STRUCTURE GUIDELINES FLIP CHIP DIRECT CHIP
ATTACH (Refer to General Guidelines Section)
20 ASSEMBLY HIERARCHY FLIP CHIP DIRECT CHIP ATTACH
20.1 Process Steps
20.2 Manual Techniques for Semiautomated Pick and Place
20.3 Automated Techniques
20.4 Single Point Attachment
20.5 Mass Attachment Properties
21 CLEANING
21.1 General Considerations
21.2 Cleanliness Assessment
21.3 Post-Soldering Cleaning
22 ELECTRICAL TEST CONSIDERATIONS
22.1 Five Types of Testing
22.2 Nodal Access
22.3 Full Nodal Access for Assembled Board
22.4 Limited Nodal Access
22.5 No Nodal Access
22.6 Clam-Shell Fixtures Impact
22.7 Printed Board Test Characteristics
23 QUALITY ASSURANCE
23.1 Relationship to Test/Inspection
23.2 Standard Magnification
23.3 Process Control
23.4 Process Verification Inspection
24 PERFORMANCE/RELIABILITY EVALUATIONS
24.1 Relationships to Test and Quality Assurance
25 REPAIR/REWORK
25.1 Reuse of Components
25.2 Heat Sinking Effects
25.3 Dependence on Printed Board Material Type
25.4 Dependence on Copper Land and Conductor Layout
25.5 Selection of Suitable Rework Equipment
25.6 Dependence on Assembly Structure and
Soldering Processes
26 COATING AND ENCAPSULATION
26.1 Conformal Coating
26.2 Encapsulation
27 DOCUMENTATION
27.1 Drawing Requirements
27.2 Electronic Data Transfer
27.3 Specifications
27.4 Printed Board Assembly Documentation Process Flow
27.5 Documentation for SMT
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