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IPC HDBK 4691 : 2015

Current
Current

The latest, up-to-date edition.

HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS
Published date

12-01-2015

1 SCOPE
2 APPLICABLE DOCUMENTS
4 ADHESIVE CHEMISTRIES
5 DISCUSSION OF MECHANICAL PROPERTIES
6 DISCUSSION OF THERMAL PROPERTIES
   AND TEST METHODS
7 DISCUSSION OF ELECTRICAL PROPERTIES
8 PHYSICAL PROPERTIES
9 DESIGN CONSIDERATIONS AND END-USE
   ENVIRONMENT
10 LONG-TERM RELIABILITY AND TESTING
11 MANUFACTURING/EQUIPMENT
   CONSIDERATIONS
12 PREPARATION FOR ADHESIVE BONDING
13 APPLICATION PROCESS MONITORING
14 REWORK AND REPAIR PROCESSES
15 ENVIRONMENTAL, HEALTH AND SAFETY
   CONSIDERATIONS
16 LEAD-FREE PROCESSING THAT AFFECTS
   ADHESIVE BONDING
17 ENVIRONMENTAL REGULATIONS

Describes the initial version of this document, the discussion of adhesives will be limited to liquid, paste and gel materials and closely related film adhesives, which require some form of cure mechanism to achieve their full performance.

DevelopmentNote
Also available in Hardcopy format. (01/2018)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES

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