• There are no items in your cart

IPC HDBK 840 : 0

Current
Current

The latest, up-to-date edition.

SOLDER MASK HANDBOOK
Published date

11-06-2006

1 INTRODUCTION
   1.1 Background
   1.2 Purpose
   1.3 Target Audience
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 Joint Industry Standards
   2.3 Telcordia
   2.4 ISO
   2.5 American Society for Testing and Materials
   2.6 Underwriters Laboratories
   2.7 International Electrotechnical Commission
3 TYPES OF SOLDER MASK
   3.1 Direct Imaging Solder Mask
         3.1.1 Screen Imaged (Screen Print)
         3.1.2 Ink Jet
         3.1.3 Laser Ablated
         3.1.4 Coverlay/Punched Film
   3.2 Photoimageable Solder Mask
         3.2.1 Dry Film (Photoimageable)
         3.2.2 Liquid Photoimageable (LPI)
         3.2.3 Laser Direct Imageable (LDI)
         3.2.4 Photoimageable Coverlay
   3.3 Temporary Solder Mask
         3.3.1 Peelable
         3.3.2 Soluble
4 CHEMICAL COMPOSITION
   4.1 Resin Systems
         4.1.1 Solvent Borne
         4.1.2 Waterborne
         4.1.3 100% Solids
         4.1.4 Solvent Free Systems
   4.2 Pigments and Fillers
         4.2.1 Matting Agents
         4.2.2 Fillers
   4.3 Photoinitiators
   4.4 Other Components
   4.5 Flame-Retardants
   4.6 Curing Systems
5 SOLDER MASK PROPERTIES
   5.1 Materials Characterization Tests vs
         Performance on Products
   5.2 Solder Mask Test Method History
   5.3 Chemical Properties of Cured Solder Mask
         5.3.1 Resistance to Solvents/Fluxes
         5.3.2 Corrosion Resistance
         5.3.3 Degree of Cure
         5.3.4 Permeability to Moisture
         5.3.5 Moisture Absorption
         5.3.6 Permeability to Gasses
         5.3.7 Outgassing
         5.3.8 Nonnutrient
         5.3.9 Hydrolytic Stability
         5.3.10 Pressurized Steam Resistance (Pressure Cooker
                 Test)
         5.3.11 Ionic Contamination
         5.3.12 Flammability
   5.4 Thermal Properties of Cured Solder Mask
         5.4.1 Thermal Stress/Cycling
         5.4.2 Thermal Shock
         5.4.3 Thermal Degradation
         5.4.4 Thermal Conductivity
         5.4.5 Maximum Operating Temperature
         5.4.6 CTE
         5.4.7 Glass Transition Temperature (Tg)
   5.5 Mechanical Properties of Cured Solder Mask
         5.5.1 Thickness
         5.5.2 Adhesion
         5.5.3 Abrasion Resistance
         5.5.4 Cracking and Flaking
         5.5.5 Shrinkage
         5.5.6 Hardness
         5.5.7 Machineability
         5.5.8 Flexibility
         5.5.9 Young's Modulus
         5.5.10 Poisson Ratio
   5.6 Visual Appearance (Gloss)
         5.6.1 Color, Opacity and Transparency
   5.7 Electrical Properties of Cured Solder Mask
         5.7.1 Dielectric Strength
         5.7.2 Dielectric Constant
         5.7.3 Dissipation Factor (Loss Tangent)
         5.7.4 SIR/Resistivity
         5.7.5 Moisture and Insulation Resistance (M&IR)
         5.7.6 Volume Resistivity
         5.7.7 Comparative Tracking Index (CTI)
         5.7.8 Electrochemical Migration
         5.7.9 Impedance Concerns
   5.8 Shelf Life and Storage
   5.9 Pot Life
6 DESIGN ASPECTS
   6.1 Choosing a Solder Mask for the Application
         6.1.1 Automotive
         6.1.2 Aerospace
         6.1.3 Telecommunication
         6.1.4 Consumer
   6.2 Design Considerations and Requirements
         6.2.1 Solder Mask Adhesion and Coverage
         6.2.2 Solder Mask Clearance
   6.3 Impedance Concerns (High Frequency Applications)
   6.4 Influence of Solder Mask Thickness on Solder Wetting
   6.5 Via Considerations
         6.5.1 Size of Holes
         6.5.2 Roughness
         6.5.3 Plating
   6.6 Via Protection
         6.6.1 Via Tenting
         6.6.2 Via Plugging
         6.6.3 Via Filling
   6.7 Solder Mask for Hybrids and MCM Packaging
         Applications
         6.7.1 Organic Substrates for Packaging
7 SOLDER MASKS AND THE APPLICATION PROCESS
   7.1 Premask Cleanliness
         7.1.1 Verification Prior to Solder Mask
                 Application
         7.1.2 Methods of Precleaning
         7.1.3 Influence of Ionic Cleanliness during
                 Presolder Mask Processes
         7.1.4 Surface Roughness
   7.2 Application/Coating Methods
         7.2.1 Viscosity
         7.2.2 Description of Processes
   7.3 Tack Drying
         7.3.1 Oven Types for Tack Drying
         7.3.2 Oven Cleanliness
         7.3.3 Process Effects
   7.4 Exposure Process (Photoimageable Solder Masks)
         7.4.1 Exposure Process Considerations
         7.4.2 Exposure Equipment
         7.4.3 Image Growth and Undercut
   7.5 Developing
         7.5.1 Solvent
         7.5.2 Aqueous
         7.5.3 Effect of Wash Offs
         7.5.4 Nozzle Types
         7.5.5 Rinsing
         7.5.6 Maintenance of Developer Chamber
         7.5.7 Waste Treatment for Developing Solution
                 and Rinsing Water
   7.6 Final Cure Mechanisms and Methods
         7.6.1 Thermal
         7.6.2 UV
         7.6.3 LPI
         7.6.4 Curing Ovens
         7.6.5 Measurement of Cure
   7.7 Strippers
   7.8 Legend Inks
         7.8.1 Legend Inks Effect of Over and Under Cure
                 of Solder Mask
         7.8.2 Cocuring with Solder Mask
   7.9 Final Finishes after Solder Mask - Interactions
         with Solder Mask
         7.9.1 OSP Finishes
         7.9.2 HASL
         7.9.3 Selective Solder Strip or Selective Reflowed
                 Tin-Lead or Fused Solder
         7.9.4 Plated Final Finishes
         7.9.5 Electroless Nickel/Immersion Gold (ENIG) Finish
         7.9.6 Immersion Tin (ISn) Finish
         7.9.7 Immersion Silver (IAg) Finish
         7.9.8 Electrolytic Nickel Gold (Ni/Au) Finish
         7.9.9 Electroless Nickel/Electroless Palladium/Immersion
                 Gold (ENi/EPd/IAu) Finish
   7.10 Storage/Packaging Methods for Delayed Processing
   7.11 Rework and Repair
   7.12 Routing
   7.13 Final Fabrication Cleaning
   7.14 SPC Methods for Controlling Solder Mask Manufacture
         and Processing
8 SOLDER MASK AND SUBSEQUENT PROCESSES
   8.1 Assembly
   8.2 Preassembly Processes
         8.2.1 Preassembly Cleaning
         8.2.2 Preassembly Baking
   8.3 Reflow Soldering (Solder Pastes)
         8.3.1 Solder Paste
         8.3.2 Solder Paste Rework
         8.3.3 Single-, Double-Sided, and other Soldering
                 Processes/Technology
         8.3.4 Solderballs
         8.3.5 Solder Bridges/Shorts
         8.3.6 Touch-Up for Insufficient Solder
   8.4 SMT Adhesive
         8.4.1 Adhesives
         8.4.2 Typical Rework of Surface Mount Adhesives
         8.4.3 Adhesion of Surface Mount Adhesive to Solder Mask
                 Surface
   8.5 Postassembly Baking
   8.6 Underfill/Glob Top/Overmolds
         8.6.1 Encapsulants and Potting Compounds
         8.6.2 Encapsulants and Wire Bonding
   8.7 Lamination
   8.8 Wave Soldering
         8.8.1 Fluxes
         8.8.2 White Staining
         8.8.3 Solderballs
         8.8.4 Solder Shorts/Bridges
         8.8.5 Solder Skips
         8.8.6 Inspection
         8.8.7 Rework
         8.8.8 Process Influences
   8.9 Selective Soldering
   8.10 Cleaning
         8.10.1 Cleaning Agents
         8.10.2 Cleaning Methods
   8.11 Conformal Coatings
         8.11.1 Application Methods of Conformal Coatings
         8.11.2 Thickness of Conformal Coating
         8.11.3 Viscosity of Conformal Coating
         8.11.4 Coatings/Types of Conformal Coating
         8.11.5 Compatibility of Conformal Coating
         8.11.6 Compatibility Testing of Conformal Coating
   8.12 Service Environment Materials
9 INDUSTRY SPECIFICATIONS AND STANDARDS
   9.1 IPC-SM-840 Document History (1977 - 2002)
         9.1.1 IPC-SM-840 Class 1,2,3 vs. Class T&H
         9.1.2 Change in Philosophy between IPC-SM-840B
                 and IPC-SM-840C
   9.2 Bellcore
   9.3 IPC-6011
   9.4 IPC-6012
   9.5 IPC-6013
10 HEALTH AND ENVIRONMENTAL CONSIDERATIONS
   10.1 Air Issues
   10.2 Water Issues
   10.3 Solid/Hazardous Waste Issues
   10.4 RoHS/WEEE/Halogen Free Issues
11 TROUBLESHOOTING METHODOLOGY
   11.1 Surface Preparation Prior to Application
   11.2 Solder Mask Imaging and Developing
   11.3 Improper Cure
   11.4 Materials Incompatibility
12 EDITORIALS
   12.1 Process Change Ethics
   12.2 Solder Mask from a Supplier Perspective
   12.3 Solder Mask from a UL Perspective
   12.4 Solder Mask from a User Perspective (PCB Shop)
   12.5 Solder Masks from an OEM Perspective
13 CHALLENGES FOR SOLDER MASK TECHNOLOGY
   13.1 High Frequency
         13.1.1 Dielectric Constant (Dk)
         13.1.2 Dissipation Factor (Df)
   13.2 Shrinking Scales/Thicknesses
   13.3 Lead Free Solder Temperatures
   13.4 Higher Operating Temperatures
   13.5 Waterborne
   13.6 Legends and Marking Inks
         13.6.1 Photoimageable Systems
         13.6.2 Ink Jet Systems
   13.7 Large Fine Pitch BGA
   13.8 Reduced Halogen
   13.9 Laser Ablation
   13.10 Environmental Regulations (RoHS)
   13.11 Solder Mask for Flexible Cable Assembly
         13.11.1 Performance Application Recommendations
                 for Solder Mask over Flex
14 GLOSSARY OF TERMS FOR SOLDER MASK

Supplements the solder mask requirements established in IPC specifications such as IPC-SM-840 and IPC-6012 by providing detailed information on solder mask types, application processes, pre- and post- assembly processes, characteristics and properties that are useful in the selection and use of the most appropriate mask type for a given application.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 2223 CHINESE : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 5702 : 0 GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS
IPC 2223 GERMAN : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC SA 61 : A POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK
IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC 4761 : 0 DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC SC 60 : A POST SOLDER SOLVENT CLEANING HANDBOOK
IPC TM 650 : 0 TEST METHODS MANUAL
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC HDBK 001 : E HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC SM 839 : 0 PRE AND POST SOLDER MASK APPLICATION CLEANING GUIDELINES
IPC 9691 : A USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
IPC PE 740 : 0 TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY
IPC AC 62 : A AQUEOUS POST SOLDER CLEANING HANDBOOK
IPC 1751 : A2010 + A1 2012 GENERIC REQUIREMENTS FOR DECLARATION PROCESS MANAGEMENT
IPC 6013 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 1752 : A-2 MATERIALS DECLARATION MANAGEMENT
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.