IPC HDI 1 : LATEST

Name: IPC HDI 1 : LATEST
Brand: IPC

Withdrawn

HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM

Withdrawn date

07-23-2013

Published date

01-12-2013

Publisher

Institute of Printed Circuits

Compiles the standards, specifications and guidelines which a company needs to produce high density interconnect (HDI) and microvia boards.

DevelopmentNote	Includes IPC 2220, IPC 2315, IPC 4104, IPC 6016, IPC 6801, IPC CF 148 and IPC CF 152. (03/2002) Also available in CD-ROM format. (09/2003)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Withdrawn

IPC CF 152 : B	COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC 2315 : 0	DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS
IPC 4104 : 1999	SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
IPC 6801 : 0	IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS

IPC 2220 : LATEST	IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC 2315 : 0	DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS
IPC CF 148 : A1998	RESIN COATED METAL FOR PRINTED BOARDS
IPC 6801 : 0	IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
IPC 4104 : 1999	SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
IPC CF 152 : B	COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC 6016 : 0	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS

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