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IPC HM 860 : 0

Current
Current

The latest, up-to-date edition.

SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
Published date

01-01-1987

Publisher

Institute of Printed Circuits

Covers the qualification & performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of 3 or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may include passive elements.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

MIL-STD-2000 Revision A:1991 STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC D 859 : 0 DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS
IPC TF 870 : 0 QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS

IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
IPC TF 870 : 0 QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS
IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES

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