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IPC MC 790 : 0

Current
Current

The latest, up-to-date edition.

GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION
Published date

07-01-1992

Publisher

Institute of Printed Circuits

Provides information on Multichip Module Technology including parametric data, design and manufacturing information, and a proposed categorization of the various approaches to multichip interconnect substrate technologies based on dielectric 'family'. Additional descriptive information regarding many of the issues and tradeoffs surrounding this technology may be obtained from the references in the Bibliography.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (08/2008)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC SM 780 : 0 COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING
IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
IPC 6015 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS

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