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IPC ML 960 : 0

Current

Current

The latest, up-to-date edition.

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR MASS LAMINATION PANELS FOR MULTILAYER PRINTED BOARDS

Published date

07-01-1994

1.0 SCOPE
     1.1 Purpose
     1.2 Classification
     1.3 Dimensions and Tolerances
     1.4 Statistical Process Control (SPC)
     1.5 Interpretation
2.0 APPLICABLE DOCUMENTS
     2.1 IPC
     2.2 Military
     2.3 Other Publications
3.0 REQUIREMENTS
     3.1 General
     3.2 Terms and Definitions
     3.3 Conflict
     3.4 Qualification and Performance
     3.5 Material
     3.6 Visual Examination
     3.7 Board Dimensional Requirements
     3.8 Conductor Definition
     3.9 Bond Strength, Outer Layer Copper
     3.10 Construction Integrity
     3.11 Electrical Requirements
     3.12 Repair
4.0 QUALITY ASSURANCE PROVISIONS
     4.1 Responsibility for Inspection
     4.2 Categories of Inspection
     4.3 Qualification Testing
     4.4 Artwork Inspection
     4.5 Materials Inspection
     4.6 Inspection of Product for Delivery
     4.7 Methods of Inspection
     4.8 Statistical Process Control (SPC)
5.0 PREPARATION FOR DELIVERY
     5.1 Packaging
     5.2 Marking
6.0 NOTES
     6.1 Ordering Data
Tables

Covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are also addressed.

DevelopmentNote
Included in IPC C 105 & IPC C 1000. (08/2008)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL

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