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IPC SM 784 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION

Available format(s)

Hardcopy

Superseded date

01-28-2013

Language(s)

English

Intended to be an aid to the provider or user of chip on board technology by providing guidelines for its successful implementation as a continuation of the evolution of electronic assembly from through hole mount to surface mount and on to the finer pitch of chip on board technology.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (08/2008)
DocumentType
Standard
Pages
53
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC J STD 013 : 0 IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY
IPC J STD 012 : 0 IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
IPC J STD 026 : 0 SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
IPC J STD 028 : 0 PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS

IPC J STD 026 : 0 SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
IPC J STD 012 : 0 IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
IPC J STD 028 : 0 PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC M 103 : LATEST STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS

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