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IPC TF 870 : 0

Current

Current

The latest, up-to-date edition.

QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS

Available format(s)

Hardcopy

Language(s)

English

Published date

11-01-1989

Defines materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through-hole technology. Can also be used for procurement of single and double-sided boards.

DocumentType
Standard
Pages
30
PublisherName
Institute of Printed Circuits
Status
Current

IPC HM 860 : 0 SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
IPC D 859 : 0 DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS
IPC A 23 : LATEST POLYMER THICK FILM ARTWORK

IPC M 102 : LATEST FLEXIBLE CIRCUITS COMPENDIUM
IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
IPC HM 860 : 0 SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS

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