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IPC TR 582 : 0

Current
Current

The latest, up-to-date edition.

CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR
Publisher

Institute of Printed Circuits

Gives test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

IPC TR 580 : 1989 CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS
IPC TR 581 : 1994 IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY

IPC SA 61 : A POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK
IPC TP 1044 : 1992 CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 2
IPC TP 1115 : 1998 SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS
IPC SC 60 : A POST SOLDER SOLVENT CLEANING HANDBOOK
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TP 1043 : 1992 CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 1
IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC TR 581 : 1994 IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY
IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
IPC AC 62 : A AQUEOUS POST SOLDER CLEANING HANDBOOK
IPC TP 1090 : 1996 THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002

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