IPC J STD 002 : D

Superseded

View Superseded by

SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES

Available format(s)

Hardcopy

Superseded date

08-23-2019

Language(s)

English

Published date

06-24-2013

Publisher

Institute of Printed Circuits

1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 TEST PROCEDURES
5 NOTES
APPENDIX A - Critical Component Surfaces
APPENDIX B - Evaluation Aids
APPENDIX C - Calculation of Maximum
             Theoretical Force
APPENDIX D - Calculation of Integrated Value
             of Area of the Wetting Curve
APPENDIX E - Informative Annex
APPENDIX F - J-STD-002/J-STD-003 Activated
             Solderability Test Flux Rationale
             Committee Letter
APPENDIX G - Graphical Representations:
             Progression of Solder Wetting
             Curve Parameters As Measured
             By Wetting Balance Testing
APPENDIX H - Test Protocol for Wetting

Describes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.

Committee	5-20
DevelopmentNote	Supersedes IPC S 805, EIA IS 49 & EIA 638. Included in IPC C 103 & IPC C 1000. Supersedes EIA 364-52. (07/2009) Also available in Chinese Language, See separate record J STD 002 CHINESE. (05/2016) Jointly Published by IPC, EIA and JEDEC. (07/2013) Supersedes EIA JESD 22-B102. (03/2016) Also available in Hardcopy format. (03/2018)
DocumentType	Standard
Pages	64
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC J-STD-002E : 2017
Supersedes	JEDEC JESD22-B102E:2007 IPC S 805 : 1985 IPC J STD 002 : C

DSCC 06012 : A	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (2.0 WATT), STYLE 2816
DSCC 04006 : A	CAPACITORS, TANTALUM, HYBRID, HERMETICALLY SEALED
MIL-PRF-32535 Revision A:2017	Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, General Specification for
ASTM B 965 : 2009	Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
DSCC 06011 : C	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (1.0 WATT), STYLE 2512
IEC 60810:2017	Lamps, light sources and LED packages for road vehicles - Performance requirements
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
PD IEC/TS 62861:2017	Guidelines for principal component reliability testing for LED light sources and LED luminaires
BS EN 61191-3:2017	Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
14/30309696 DC : 0	BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS EN 61191-1:2013	Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 60810 : 2018	LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
EN 62435-5:2017	Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
I.S. EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
MIL-DTL-83731 Revision E:2016	SWITCHES, TOGGLE, UNSEALED AND SEALED, GENERAL SPECIFICATION FOR
IPC TR 461 : 1979	SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS
IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK
IPC J STD 001 SWEDISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 DANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL-STD-202-208 Base Document:2015	METHOD 208, SOLDERABILITY
IPC J STD 003 CHINESE : B	SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC J STD 001 RUSSIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC SPVC-LAT1 : 2010	ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA
IPC WHMA A 620 HUNGARIAN : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC J STD 001 TURKISH : E2010	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 TURKISH : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC TA 722 : 1990	TECHNOLOGY ASSESSMENT HANDBOOK ON SOLDERING
IPC WHMA A 620 HEBREW : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC A 610 CZECH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7093 CHINESE : -	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC A 610 GERMAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 9592 : B	REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES
IPC TR 465 1 : 1993	ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY
IPC A 610 ESTONIAN : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 SPANISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 CHINESE : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC TR 462 : 0	SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
IPC A 610 DUTCH : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 VIETNAMESE : B2012	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC A 610 KOREAN : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC CH 65 : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC SPVC2005-CD : 2005	ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER
IPC CH 65 CHINESE : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC A 610 ITALIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TR 466 : 1995	TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST
IPC A 610 FRENCH : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL STD 750-2 : A	MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999
MIL-PRF-8805 Revision G:2016	SWITCHES AND SWITCH ASSEMBLIES, SENSITIVE, SNAP ACTION (BASIC, LIMIT, PUSH BUTTON AND TOGGLE SWITCHES), GENERAL SPECIFICATION FOR
IPC J STD 001 HUNGARIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 GERMAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 SWEDISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC HDBK 005 : 0	GUIDE TO SOLDER PASTE ASSESSMENT
IPC J STD 075 GERMAN : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
MIL-PRF-83446-36 Revision B:2012	COILS, RADIO FREQUENCY, CHIP, OPEN CONSTRUCTION, SURFACE MOUNT, 0603 SIZE
IPC A 610 HUNGARIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 POLISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
MIL-DTL-3950 Revision K:2016	Switches, Toggle, Environmentally Sealed, General Specification for
IPC 7351 GERMAN : B	Basic requirements for SMT design and SMD patch guideline
IPC A 610 CHINESE : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL STD 11991 : A	GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
IPC A 610 JAPANESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 075 CHINESE : -	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IPC J STD 001 DANISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TR 465 3 : -	EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A
IPC A 610 VIETNAMESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 KOREAN : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
MIL-PRF-83446-37 Revision A:2011	COILS, RADIO FREQUENCY, CHIP, OPEN CONSTRUCTION, SURFACE MOUNT, 0805 SIZE
MIL-PRF-39010-15 Base Document:2013	COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, CERAMIC CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY
DSCC 06009 : A	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.25 WATT), STYLE 1206
DSCC 06010 : B	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.5 WATT), STYLE 2010
DSCC 15010 : A	CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED
BS EN 60810:2015	Lamps for road vehicles. Performance requirements
DSCC 06007 : A	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.1 WATT), STYLE 0603
VDE 0468-2-69 : 2018	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
ASTM B 965 : 2009 : R2014	Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
PD IEC/TS 62647-1:2012	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
I.S. EN 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
IPC J STD 001 CHINESE : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
I.S. EN 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
IPC J STD 001 SPANISH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC WHMA A 620 DANISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
DSCC 04003 : E	CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED
DSCC 06008 : A	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.125 WATT), STYLE 0805
EN 60068-2-69:2017/AC:2018-03	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
I.S. EN 60810:2015	LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
MIL-PRF-32560-2 Base Document:2016	COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT
MIL-PRF-32560-1 Base Document:2016	COIL, RADIO FREQUENCY, CHIP, FIXED, CONFORMAL COATED, ESTABLISHED RELIABILITY, SURFACE MOUNT
MIL-PRF-32560-6 Base Document:2016	COIL, RADIO FREQUENCY, CHIP, FIXED, OPEN CONSTRUCTION ESTABLISHED RELIABILITY, SURFACE MOUNT, 0603 SIZE
DIN EN 60068-2-69 : 2007	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
BS EN 61191-4:2017	Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IPC J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IEC TS 62647-1:2012	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
I.S. EN IEC 60810:2018	LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
MIL-PRF-39010-16 Base Document:2013	COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, FERRITE CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY
SAE J 2685 : 2014	POSITIVE TEMPERATURE COEFFICIENT OVERCURRENT PROTECTION DEVICES (PTCS)
IEC PAS 62686-2:2016	Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
I.S. EN 60068-2-69:2017	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
EN IEC 60810:2018	Lamps, light sources and led packages for road vehicles - Performance requirements
BS EN IEC 60810:2018	Lamps, light sources and led packages for road vehicles. Performance requirements
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC TS 62668-2:2016	Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
16/30350012 DC : 0	BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
PD IEC/PAS 62686-2:2016	Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components
IEC PAS 62647-1:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
PD IEC/PAS 62647-1:2011	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
IEC 62435-5:2017	Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC TS 62647-22:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-22:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
BS EN 62435-5:2017	Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
PD IEC/TS 62668-2:2016	Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources
IEC 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
MIL-PRF-83421 Revision F:2017	CAPACITOR, FIXED, METALLIZED PLASTIC FILM DIELECTRIC, (DC, AC, OR DC AND AC), HERMETICALLY SEALED IN METAL CASES OR CERAMIC CASES, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
MIL-PRF-10304 Revision F:1999	METERS, ELECTRICAL INDICATING, PANEL TYPE, RUGGEDIZED, GENERAL SPECIFICATION FOR
BS EN 60068-2-69:2017	Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
SAE AS 22759 : 2014	WIRE, ELECTRICAL, FLUOROPOLYMER-INSULATED, COPPER OR COPPER ALLOY
SAE AS 29606 : 2014	WIRE, ELECTRICAL, STRANDED, UNINSULATED COPPER, COPPER ALLOY, OR ALUMINUM, OR THERMOCOUPLE EXTENSION, GENERAL SPECIFICATION FOR
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
PD IEC/TS 62647-22:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
IEC TS 62861:2017	Guidelines for principal component reliability testing for LED light sources and LED luminaires
MIL-PRF-20 Revision N:2017	CAPACITOR, FIXED, CERAMIC DIELECTRIC, (TEMPERATURE COMPENSATING), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
MIL PRF 55365 : 0012	CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR
EN 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
SAE AS 6324 : 2017	VERIFICATION OF NEW CONDUCTOR ALLOYS FOR AS29606 CONDUCTORS QUALIFICATION