1 Scope
   1.1 Purpose
   1.2 Categorization
   1.3 Presentation
   1.4 Producibility
2 Technology Overview of Board and Assembly
   Requirements
   2.1 The Drivers for Component Packaging
   2.2 Issues in Component Packaging
   2.3 Impact on Interconnecting (Printed Board)
        Technology
   2.4 Impact on Assembly
   2.5 Future Implementation Strategies
3 Component Packages
   3.1 Component Identification
   3.2 Component Materials
   3.3 Heat Dissipation Techniques
   3.4 Handling and Storage
4 Package Details
   4.1 Area Array Package Description
   4.2 BGA Types
   4.3 Material Decisions
   4.4 Area Array Selection Process
   4.5 Peripheral Lead Package Descriptions
   4.6 Sockets
5 Interconnecting Structures
   5.1 Interconnecting Structure Descriptions
   5.2 Material Selection
   5.3 Manufacturing Options
   5.4 Conductor Routing Methodologies
   5.5 Test Methodology
6 Assembly Processes
   6.1 Assembly Classification
   6.2 Assembly Materials
   6.3 Equipment Characteristics
   6.4 Package Attachment Process Details
   6.5 Assembled Board Test
7 Design for Reliability (DfR)
   7.1 Damage Mechanisms and Failure of Solder
        Attachments
   7.2 Reliability Prediction Modelling
   7.3 DfR-Process
   7.4 Validation and Qualification Tests
   7.5 Screening Procedures
   7.6 Reliability Expectations
8 Standardization
   8.1 Standards for Development
   8.2 Ball Grid Array Development and Performance
        Standards
   8.3 Standard on Mounting of Substrate Design and
        Performance
   8.4 Ball Grid Array/Substrate Assembly Design and
        Performance Standards
   8.5 Standards for Material Performance
9 Future Needs
   9.1 Critical Factor: Manufacturing Infrastructure
   9.2 Critical Factor: Bump Attachment and Bonding
   9.3 Critical Factor: Testing Scenarios
   9.4 Total Quality Management and Manufacturing
        (TQMM)
Figures
Tables