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JIS Z 3282:2006

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Soft solders - Chemical compositions and forms
Available format(s)

Hardcopy , PDF

Superseded date

09-22-2017

Language(s)

Japanese, English

Published date

03-25-2006

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This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries and soft solders not containing lead.

DocumentType
Standard
Pages
0
PublisherName
Japanese Standards Association
Status
Superseded
SupersededBy
Supersedes

Reaffirmed 2015

JIS Z 3198-1:2003 Test methods for lead-free solders Part 1: Methods for measuring of melting temperature ranges
JIS H 0321:1973 General rules for inspection of non-ferrous metal materials
JIS Z 3910:2008 Methods for chemical analysis of solder
JIS Z 3910:1990 Methods for chemical analysis of solder
JIS Z 3284:1994 Solder paste

JIS C 5321:1997 Methods of test for high frequency inductors and intermediate frequency transformers for electronic equipment
JIS Z 3197:1999 Testing methods for soldering fluxes
JIS H 8624:1999 Electroplated coatings of Tin-Lead alloys
JIS C 5402:1992 Method for test of connectors for use in electronic equipment
JIS H 8645:1999 Autocatalytic nickel-phosphorus coatings on metals
JIS Z 3198-5:2003 Test methods for lead-free solders Part 5: Methods for tensile tests and shear tests on solder joints
JIS L 6405:1978 Wire Healds For Frame Weaving Of Looms
JIS Z 1602:2003 18 liter metal cans
JIS C 5012:1993 Test methods for printed wiring boards
JIS H 8504:1999 Methods of adhesion test for metallic coatings
JIS C 6462:1996 Test methods of variable capacitors for use in electronic equipment
JIS C 3003:1999 Methods of test for enamelled wires
JIS A 4413:1991 Piping Units For Dwellings
JIS C 5444:2000 Testing methods of surface mounting switches for use in electronic equipment
JIS Z 3198-4:2003 Test methods for lead-free solders Part 4: Methods for solderbility test by a wetting balance method and a contact angle method
JIS H 8621:1998 Electroplated coatings of silver for engineering purposes
JIS F 7603:1992 Small Ships - Tools And Instruments Of Engine Department
JIS Z 3910:1990 Methods for chemical analysis of solder
JIS C 60068-2-21:2002 Environmental testing Part 2-21: Tests - Test U: Robustness of termination and integral mounting devices
JIS C 5441:1994 Testing methods of switches for use in electronic equipment
JIS C 5202:1990 Test methods of fixed resistors for electronic equipment
JIS H 8620:1998 Electroplated coatings of gold and gold alloy for engineering purposes
JIS Z 3851:1992 Standard qualification procedure for micro soldering technique
JIS K 2408:1996 Corrosion Inhibitors For Engine Coolant
JIS C 6471:1995 Test methods of copper-clad laminates for flexible printed wiring boards
JIS Z 3283:2006 Resin flux cored solders
JIS C 6481:1996 Test methods of copper-clad laminates for printed wiring boards
JIS H 8619:1999 Electroplated coatings of tin
JIS Z 3284:1994 Solder paste
JIS C 61191-1:2006 Printed Board Assemblies - Part 1: Generic Specification - Requirements For Soldered Electrical And Electronic Assemblies Using Surface Mount And Related Assembly Technologies
JIS E 4118:2004 Bourdon Tube Pressure Gauges For Railway Rolling Stock
JIS Z 3910:2008 Methods for chemical analysis of solder
JIS C 62024-1:2006 High Frequency Inductive Components - Electrical Characteristics And Measuring Methods - Part 1: Nanohenry Range Chip Inductor

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