MIL HDBK 338/2 : 0

Paragraph
1.0 Scope
1.1 General information
1.1.1 History of component reliability
References
1.1.2 Need for reliable components
1.1.3 Present state of the art
References
1.1.4 Future trends
References
2.0 Referenced documents
2.1 Issues of documents
3.0 Definitions
4.0 Reliability theory
4.1 Introduction
4.1.1 Definitions
4.2 Probability distributions
4.2.1 General
4.2.2 Distributions used in reliability
4.2.3 Confidence intervals
4.2.4 Statistical quality control
4.3 Temperature dependence of failure rate
4.3.1 Arrhenius model
4.3.2 Eyring model
4.3.3 Activation energy
References
5.0 Component reliability design considerations
5.1 Part selection and control
5.1.1 Part control
5.1.2 Standard part selection
5.1.3 Part approval
5.1.4 Critical parts
5.1.5 Failure rate prediction
5.2 Parts selection guidelines
5.2.1 Microcircuits
5.2.2 Discrete semiconductor devices
References
5.2.3 Resistors
5.2.4 Capacitors
5.2.5 Magnetic devices
5.2.6 Relays
5.2.7 Switches
5.2.8 Electrical connectors
5.2.9 Electron tubes
5.2.10 Cables
5.2.11 Electro optics/fiber optics
References
5.2.12 Printed circuitry
5.2.13 Standard electronic module (SEM) program
References
6.0 Applications guidelines
6.1 Environmental considerations
6.1.1 Environmental resistance
6.1.2 Environmental factors
6.1.3 Environmental resistance provisions
6.1.4 General packaging considerations
6.1.5 Production environmental stress
6.1.6 Electrostatic discharge control (ESD)
References
6.2 Design guidelines for reliable circuits
6.2.1 Electrical derating
6.2.2 Thermal design
6.2.3 Guidelines for achieving reliable thermal
        designs
6.2.4 Management of thermal designs
6.2.5 Limitations of current state-of-the-art
References
7.0 Specification and control during acquisition
7.1 Part screening
7.1.1 Theory and purpose of screening
7.1.2 Design of component screens
7.1.3 Screening cost effectiveness
7.2 Microcircuit testing
7.2.1 Testing concepts
7.2.2 Memory testing
7.2.3 Testing of LSI random logic
7.3 Management for reliable components
7.3.1 Part selection and control
7.3.2 Reliability programs
8.0 Logistic support
8.1 Storage
8.1.1 General storage considerations for parts
8.1.2 Microcircuit storage characteristics
8.1.3 Discrete semiconductors storage characteristics
8.1.4 Resistor storage environments
8.1.5 Capacitor storage characteristics
8.1.6 Inductive device storage characteristics
8.1.7 Printed circuit storage characteristics
8.1.8 Protection methods
8.2 Spare parts provisioning
8.2.1 Control of parts in military deployed equipment/
        systems
8.2.2 Spares provisioning techniques
References
9.0 Failure reporting and analysis
9.1 Failure reporting
9.1.1 Closed loop failure reporting/corrective actions
        systems
9.1.2 Failure reporting systems
9.1.3 Failure reporting forms
9.2 Failure analysis
9.2.1 General considerations in failure analysis
9.2.2 Failure analysis apparatus
9.2.3 Information obtained from failure analysis
9.2.4 Common causes of parts failure
9.2.5 Failure categories
References
Appendix A Factor affecting failure rates of parts
Appendix B Base failure rates for electron tubes
            (includes both random and wearout failures)
NUMEROUS TABLES
NUMEROUS FIGURES