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SEMI G44 : 1994

SEMI G44 : 1994

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR LEAD FINISHES FOR GLASS TO METAL SEAL CERAMIC PACKAGES (ACTIVE DEVICES ONLY)

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines lead finishes for glass to metal seal ceramic packages assembled with iron-nickel alloy leadframe construction. Defines properties, composition, limits, and refers to appropriate tests for utility. Criteria detailed applies to glass to metal seal ceramic packages, assembled with iron-nickel alloy leadframe construction which complies with the composition limits specified in MIL-M-38510 as lead material Type A or Type B.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G2 : 1994 SPECIFICATION FOR METALLIC LEADFRAMES FOR CER-DIP PACKAGES
SEMI G35 : 1987 SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR (ACTIVE) DEVICES

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