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ASTM D 1867 : 2013 : REDLINE

Current
Current

The latest, up-to-date edition.

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
Available format(s)

PDF

Language(s)

English

Published date

11-01-2013

Publisher

American Society for Testing and Materials

CONTAINED IN VOL. 10.01, 2015 Defines twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces.

1.1This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Committee
D 09
DocumentType
Redline
Pages
9
PublisherName
American Society for Testing and Materials
Status
Current

MIL STD 750-2 : A MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999
MIL-DTL-28754-6 Revision D:2014 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 PIN, STRAIGHT THROUGH
MIL-DTL-28754-11 Revision F:2014 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 CONTACT, RIGHT ANGLE (FOR SOLID OR DIP FRAME)
MIL-DTL-28754 Revision E:2016 Connectors, Electrical, Modular, and Component Parts General Specification for
ASTM D 1825 : 2003 Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012)
ASTM B 451 : 1993 Specification for Copper Foil, Strip, and Sheet for Printed Circuits and Carrier Tapes (Withdrawn 1998)
ASTM D 5109 : 2012 : REDLINE Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

ASTM D 709 : 2017 : REDLINE Standard Specification for Laminated Thermosetting Materials
ASTM D 1711 : 2015 : REDLINE Standard Terminology Relating to Electrical Insulation
ASTM D 5109 : 2012 : REDLINE Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
NEMA LI 1 : 1998(R2011) INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS

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