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ASTM D 5109 : 2012 : REDLINE

ASTM D 5109 : 2012 : REDLINE

Current

Current

The latest, up-to-date edition.

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

Available format(s)

PDF

Language(s)

English

Published date

11-01-2012

Publisher

American Society for Testing and Materials

CONTAINED IN VOL. 10.02, 2015 Specifies the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.2 The procedures appear in the following sections:

Procedure

Section

 Referenced Documents

2

 Conditioning

4

 Dielectric Breakdown Voltage Parallel to Laminations

13

 Dimensional Instability

19

 Dissipation Factor

14

 Flammability Rating Test

16

 Flexural Strength, Flatwise at Elevated Temperature

15

 Flexural Strength, Flatwise at Room Temperature

15

 Oven Blister Test

17

 Peel Strength Test at Elevated Temperature

10

 Peel Strength Test at Room Temperature

9

 Permittivity

14

 Pin Holes in Copper Surface

20

 Purity of Copper

5

 Scratches in Copper Surface

21

 Solder Float Test

8

 Solvent Resistance

7

 Surface Resistivity

11

 Volume Resistivity

11

 Terminology

3

 Thickness & Thickness Variation

18

 Warp or Twist

6

 Water Absorption

12


1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

Committee
D 09
DocumentType
Redline
Pages
11
PublisherName
American Society for Testing and Materials
Status
Current

ASTM D 1867 : 2013 : REDLINE Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

ASTM D 618 : 2013 : REDLINE Standard Practice for Conditioning Plastics for Testing
ASTM D 1711 : 2015 : REDLINE Standard Terminology Relating to Electrical Insulation
ASTM D 1825 : 2003 Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012)
ASTM D 257 : 2014 : REDLINE Standard Test Methods for DC Resistance or Conductance of Insulating Materials
NEMA LI 1 : 1998(R2011) INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS
ASTM D 374 : 1999 Standard Test Methods for Thickness of Solid Electrical Insulation
ASTM D 1867 : 2013 : REDLINE Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

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