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ASTM F 2113 : 2001 : R2007

ASTM F 2113 : 2001 : R2007

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications

Available format(s)

Hardcopy , PDF

Superseded date

11-11-2014

Language(s)

English

Published date

06-01-2007

Publisher

American Society for Testing and Materials

CONTAINED IN VOL. 10.04, 2015 Includes sputtering targets used as thin film source material in fabricating semiconductor electronic devices.

1.1 This guide covers sputtering targets used as thin film source material in fabricating semiconductor electronic devices. It should be used to develop target specifications for specific materials and should be referenced therein.

1.2 This standard sets purity grade levels, analytical methods and impurity content reporting method and format.

1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.

Committee
F 01
DocumentType
Guide
Pages
2
ProductNote
Reconfirmed 2007
PublisherName
American Society for Testing and Materials
Status
Superseded
SupersededBy
Supersedes

ASTM F 3192 : 2016 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)

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PDF - English
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