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ASTM F 584 : 2006

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

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withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
Available format(s)

Hardcopy , PDF

Withdrawn date

01-31-2015

Language(s)

English

Published date

01-01-2006

CONTAINED IN VOL. 10.04, 2014 Defines conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.

Committee
F 01
DocumentType
Standard Practice
Pages
7
PublisherName
American Society for Testing and Materials
Status
Withdrawn
SupersededBy
Supersedes

ASTM F 72 : 2006 Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015)
FED-STD-209 Revision E:1992 AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES

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