BS 4584-103.1:1990

Withdrawn

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

Available format(s)

Hardcopy , PDF

Withdrawn date

04-24-2012

Language(s)

English

Published date

02-28-1990

Publisher

British Standards Institution

National foreword
Committees responsible
Specification
1. Scope
2. Designations
3. Materials and construction
4. Bonding sheet material
5. Methods of test for bonding sheet material
Figure
1. Position of specimens for resin content, resin
flow, volatiles content and thickness

Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.

Committee	EPL/501
DevelopmentNote	Also numbered as IEC 60249-3-1 Supersedes 89/23231 DC and BS 4584-11(1977) (08/2005)
DocumentType	Standard
Pages	12
PublisherName	British Standards Institution
Status	Withdrawn
Supersedes	BS 4584-11:1977

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