BS 5909:1980
Current
Current
The latest, up-to-date edition.
Method for scale adhesion test for oxygen-free copper
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
04-30-1980
Publisher
Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
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