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BS 6221-2:1991

BS 6221-2:1991

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Printed wiring boards Methods of test

Available format(s)

Hardcopy , PDF

Withdrawn date

04-24-2012

Language(s)

English

Published date

06-28-1991

Publisher

British Standards Institution

Committees responsible
National foreword
Method
1. Introduction
2. Scope
3. Object
4. General
5. General examination
6. Electrical tests
7. Mechanical tests
8. Miscellaneous tests
9. Environmental conditioning
Annexes
A. List of tests
B. Outgassing test of plated-through holes
Figures
1. Untitled
2. Untitled
3. Test probes for current-carrying capacity test
4. Untitled
5. Solderability
6. Needle burner test. Side views of test board and
    burner
7. Abrasion fixture
8. Fluidized sand bath
9. Example of a soldering tool
10. Plier fixture for thermal shock test, dip soldering
11. Schematic layout of steam/oxygen ageing test
    apparatus
12. Examples of typical test coupons
B.1 Untitled
B.2 Untitled
B.3 Untitled
B.4 Plated-through hole normal view under stereo
    microscope without oil and view of land after
    testing with soldering iron
B.5 Plated-through hole with oil. Convex meniscus. The
    wall is not visible
B.6 Plated-through hole with oil. Concave meniscus. The
    wall is visible
B.7 Defective plate-through hole. Formation of bubbles
    in the oil

Test methods and procedures including environmental conditioning for printed boards.

Committee
EPL/501
DevelopmentNote
Also numbered as IEC 60326-2 Supersedes BS 6221-2(1982) (09/2005)
DocumentType
Standard
Pages
78
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

BS 123300-003:2001 System of quality assessment. Capability detail specification. Rigid multilayer printed boards
BS EN 123800:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
BS 123800-003:2001 System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
BS EN 123400:1992 Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
BS 123400-003:2001 System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
BS 6221-6:1982 Printed wiring boards Specification for multilayer printed wiring boards
BS EN 123500-800:1992 Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
BS 123200:2001 System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
BS EN 123400-800:1992 Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
BS EN 123600:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
BS 4584-103.3:1992 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
BS EN 123500:1992 Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
BS 123200-003:2001 System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
BS 123100:2001 System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
BS EN 123100:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
BS 6221-11:1991 Printed wiring boards Specification for flex-rigid multilayer printed boards with through connections
BS 123500:2001 System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
BS 123700:2001 System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
BS 123600:2001 System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
BS EN 60068-2-44:1995 Environmental testing. Test methods Tests. Guidance on Test T. Soldering
BS 123000:2001 System of quality assessment. Generic specification. Printed boards
BS CECC 23200-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
BS 123600-003:2001 System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
BS EN 61249-8-7:1997 Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
BS 6221-10:1991 Printed wiring boards Specification for flex-rigid double-sided printed boards with through connections
BS CECC 123400-003:1994 Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
BS EN 123300:1992 Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
BS EN 123200:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
BS 123300:2001 System of quality assessment. Sectional specification. Rigid multilayer printed boards
BS 123100-003:2001 System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
BS CECC 23300-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
BS 6221-9:1991 Printed wiring boards Specification for flexible multilayer boards with through connections
BS 123400:2001 System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
BS 6221-4:1982 Printed wiring boards Method for specifying single and double sided printed wiring boards with plain holes
BS 123700-003:2001 System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
BS 7822-3:1995 Insulation coordination for equipment within low-voltage systems Use of coatings to achieve insulation coordination of printed board assemblies
BS EN 123700:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections
BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
BS 123800:2001 System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
BS 6221-12:1992 Printed wiring boards Specification for mass lamination panels (semi-manufactured multilayer printed boards)

BS 5830:1979 Specification for grid system for printed circuits
BS 6458-2.2(1984) : 1984 FIRE HAZARD TESTING FOR ELECTROTECHNICAL PRODUCTS - METHODS OF TEST - NEEDLE FLAME TEST
BS 6413-0:1983 Lubricants, industrial oils and related products (class L) Classification (general)
IEC 60454-3-1:1998+AMD1:2001 CSV Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
BS 6458-2.1:1984 Fire hazard testing for electrotechnical products. Test methods Glow-wire test
BS 6221-6:1982 Printed wiring boards Specification for multilayer printed wiring boards
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
BS 6221-5:1982 Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes
IEC 60326-1:1984 Printed boards - Part 1: General information for the specification writer
IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
BS 2011-2.1T:1981 Environmental testing. Tests Test T. Soldering

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