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BS 6221-25:2000

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies
Available format(s)

Hardcopy , PDF

Withdrawn date

03-12-2014

Language(s)

English

Published date

11-15-2000

Committees responsible
Foreword
1 Scope
2 Normative references
3 Terminology
4 Classification of rework activities
5 Pre-soldering rework
6 Factors affecting post-soldering rework
7 Preparation for post-soldering rework and repair
8 Post-soldering rework
9 Selection of rework equipment, tools and methods
10 Manual rework tools and methods
11 Mechanized and programmable rework machines
12 Ancillary tools and equipment
13 Rework recording procedures
14 Training of operators and inspectors
15 Field repair
Bibliography
Figure 1 - Typical in-process surface mount rework activities
Table 1 - Recommended tools for different component types

This part of BS 6221 gives guidance on the procedures to be adopted in the rework of soldered surface mounted printed board assemblies. It is applicable to activities specific to the processes used to manufacture soldered surface mounted assemblies on printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products.

Committee
EPL/501
DevelopmentNote
Supersedes 99/203718 DC (09/2005) Reviewed and confirmed by BSI, July 2007. (06/2007)
DocumentType
Standard
Pages
28
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

DEFSTAN 00-970(PT0)/9(2012) : 2012 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/17(2016) : 2016 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT9)/5(2009) : 2009 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 9: UAV SYSTEMS
DEFSTAN 00-970(PT0)/7(2011) : 2011 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/14(2014) : 2014 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/12(2014) : 2014 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/11(2013) : 2013 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/13(2014) : 2014 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/15(2015) : 2015 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/8(2011) : 2011 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/16(2015) : 2015 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS
DEFSTAN 00-970(PT0)/10(2013) : 2013 DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS

BS EN 100015-1:1992 Basic specification. Protection of electrostatic sensitive devices Harmonized system of quality assessment for electronic components. Basic specification: protection of electrostatic sensitive devices. General requirements
BS EN 61760-1:2006 Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
97/206324 DC : DRAFT MAY 1997
BS QC 200012:1996 Process assessment schedule for printed board design facilities
IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
CECC 210 003 : 1996 TECHNOLOGY APPROVAL SCHEDULE: RIGID PRINTED BOARDS
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
BS CECC 200025:1998 Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
BS EN 100015-3:1994 Basic specification. Protection of electrostatic sensitive devices Requirements for clean room areas
BS EN 100015-4:1994 Basic specification. Protection of electrostatic sensitive devices Requirements for high voltage environments
BS EN 100015-2:1994 Basic specification. Protection of electrostatic sensitive devices Requirements for low humidity conditions
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

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