BS 9762:1988

Withdrawn

Sectional specification for capability approval of manufacture of double-sided rigid printed wiring boards of assessed quality with plated through holes

Available format(s)

Hardcopy , PDF

Withdrawn date

12-15-2000

Language(s)

English

Published date

10-31-1988

Publisher

British Standards Institution

Foreword
Committees responsible
Specification
Section one. General
1.1 Scope
1.2 Related documents
1.3 Base metals
1.4 Customer detail specification
1.5 Inspection
Section two. Capability approval
2.1 Description of capability: limits of approval
2.2 Demonstration of capability
2.3 Capability CTP allocation
2.4 Capability approval acceptance levels
2.5 Capability approval report
2.6 Abstract of description of capability
Section three. Quality conformance inspection
3.1 General
3.2 Certified test records
Appendices
A CTP dimensions and finish for double-sided boards
     with PTHs
B Group pattern layout for double-sided boards with
     PTHs
C Detailed dimensions of specimens shown in appendix
     B
D CTP layout
E Example of format for abstract of description of
     capability for inclusion in PD 9002
F Format for customer detail specification for
     printed wiring boards with PTHs complying with
     BS 9762
G Solder resist and marking ink masks
H Test pattern for bonded heat sinks
Tables
1 CTP allocation
2 Schedule of tests for capability approval for
     double-sided boards with PTHs
3 Quality conformance inspection: double-sided
     printed wiring boards with PTHs
Figures
1 Examples of acceptable and non-acceptable soldered
     holes
2 CTP for double-sided boards with PTHs
3 CTP layout
4 Solder resist mask
5 Marking ink mask
6 Test pattern for bonded heat sinks

Specifies applicable tests and requirements taken from those listed in BS 9760. Also requirements for capability approval and quality conformance during manufacture.

Committee	EPL/501
DocumentType	Standard
Pages	30
PublisherName	British Standards Institution
Status	Withdrawn
Supersedes	BS 9762:1977

BS 4584-10:1977	Specification for metal-clad base materials for printed circuits Flexible copper-clad polyimide film: PI-F-Cu-10
BS 2011-2.1Ca:1977	Environmental testing. Tests Test Ca. Damp heat, steady state
BS 4584-3:1972	Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, flame retardant grade: EP-GC-Cu-3
BS 4584-9:1977	Specification for metal-clad base materials for printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9
BS 4584-2:1972	Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2