BS 9764:1988

Withdrawn

Sectional specification for capability approval of manufacturers of single- or double-sided flexible printed wiring boards of assessed quality without through hole connections and with or without rigidizing component materials

Available format(s)

Hardcopy , PDF

Withdrawn date

12-15-2000

Language(s)

English

Published date

10-31-1988

Publisher

British Standards Institution

Foreword
Committees responsible
Specification
Section one. General
1.1 Scope
1.2 Related documents
1.3 Base metals
1.4 Customer detail specification
1.5 Inspection
Section two. Capability approval and quality
                conformance inspection of flexible
                printed wiring boards
2.1 Description of capability: limits of approval
2.2 Demonstration of capability
2.3 Capability CTP allocation
2.4 Capability approval acceptance levels
2.5 Capability approval report
2.6 Abstract of description of capability
2.7 Quality conformance inspection
Section three. Extension of assessment and quality
                conformance inspection for flexi-rigid
                printed wiring boards
3.1 Inspection
3.2 Description of capability: limits of approval
3.3 Demonstration of capability: extension for flexi-
     rigid printed wiring boards
Appendices
A CTP dimensions and finish for flexible boards
     without through hole connections
B Group pattern layout for flexible boards with
     through hole connections
C Detailed dimensions of specimens shown in appendix
     B
D CTP layout
E Examples of delamination
F Examples of hole defects
G Format for customer detail specification for
     flexible single- or double-sided printed wiring
     boards without through hole connections and with or
     without rigidizing component materials and
     complying with BS 7964
H Example of format for abstract of description of
     capability for inclusion in PD 9002
J Flexible printed wiring board base materials
K CTP for flexi-rigid printed wiring boards
L Method for measurement of peel strength of flexible
     board to rigidizing component
Tables
1 CTP allocation
2 Allocation of CTP specimens
3 Schedule of tests for capability approval for
     flexible printed wiring boards without through hole
     connections
4 Quality conformance inspection: flexible printed
     wiring boards without through hole connections
5 Schedule of additional tests for extension of
     capability to include flexi-rigid printed wiring
     boards
6 Quality conformance inspection: flexi-rigid printed
     wiring boards
7 Typical properties of materials for flexible
     printed wiring boards
Figures
1 CTP for flexible boards without through hole
     connections
2 CTP layout
3 CTP assembly
4 Component parts of the CTP

Specifies applicable tests and requirements taken from those listed in BS 9760. Also the requirements for capability approval and for quality conformance during manufacture.

Committee	EPL/501
DocumentType	Standard
Pages	40
PublisherName	British Standards Institution
Status	Withdrawn
Supersedes	BS 9764:1979

BS 4584-10:1977	Specification for metal-clad base materials for printed circuits Flexible copper-clad polyimide film: PI-F-Cu-10
BS 2011-2.1Ca:1977	Environmental testing. Tests Test Ca. Damp heat, steady state
BS 4584-3:1972	Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, flame retardant grade: EP-GC-Cu-3
BS 4584-9:1977	Specification for metal-clad base materials for printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9
BS 4584-2:1972	Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2