BS 9930-0(1983) : AMD 5955

National foreword
Committees responsible
Section One - Scope
1. Scope
Section Two - General
2. General
2.1 Related documents
2.2 Units, symbols and terminology
2.3 Preferred values
2.4 Marking
Section Three - Quality assessment procedures
3. Quality assessment procedures
3.1 Qualification Approval/Quality Assessment Systems
3.2 Primary Stage of Manufacture
3.3 Structurally Similar Components
3.4 Qualification Approval Procedures
3.5 Quality Conformance Inspection
3.6 Alternative test methods
3.7 Unchecked parameters
Section Four - Test and measurement procedures
4. Test and measurement procedures
4.1 General
4.2 Standard atmospheric conditions
4.3 Drying
4.4 Visual examination and check of dimensions
4.5 Insulation resistance
4.6 Voltage proof
4.7 Capacitance
4.8 Tangent of loss angle
4.9 Leakage current
4.10 Impedance (under consideration)
4.11 Inductance (under consideration)
4.12 Outer foil termination
4.13 Robustness of terminations
4.14 Resistance to soldering heat
4.15 Solderability
4.16 Rapid change of temperature
4.17 Vibration
4.18 Bump
4.19 Shock
4.20 Container sealing
4.21 Climatic sequence
4.22 Damp heat steady state
4.23 Endurance
4.24 Variation of capacitance with temperature
4.25 Storage
4.26 Surge
4.27 Charge and discharge test
4.28 Pressure relief (for electrolytic capacitors)
4.29 Characteristics at high and low temperature
4.30 Thermal stability test
4.31 Component solvent resistance
4.32 Solvent resistance of the marking
Appendix A - Interpretation of sampling plans and
             procedures as described in IEC Publication
             410 for use within the IEC Quality
             Assessment System for Electronic Components
Appendix B - Rules for the preparation of detail
             specifications for capacitors and resistors
             for electronic equipment
Appendix C - Guide for pulse testing of capacitors