BS EN 166100:1998

1 Scope
2 General, preferred ratings and guidance on detail
    specifications
    2.1 Related documents
    2.2 Preferred ratings and characteristics
    2.3 Information to be prescribed in detail
          specifications
3 Capability approval
    3.1 Eligibility for capability approval
    3.2 Structural similarity
    3.3 Procedures for capability approval
    3.4 Description of capability
    3.5 Capability qualifying components (CQCs)
    3.6 Inspection requirements for CQCs
    3.7 Programme for capability approval
    3.8 Capability approval report
    3.9 Abstract of description of capability
    3.10 Modifications likely to affect capability approval
    3.11 Initial capability approval
    3.12 Maintenance of capability approval
    3.13 Rework and repair work
    3.14 Quality conformance inspection
    3.15 Screening procedures
4 Test and measurements procedures
Annexes
A Example layout of an abstract of description of
    capability for inclusion in CECC 00 200
B Layout of the front page of a CQC specification for
    process control
C Layout of the front page of a CQC specification to
    demonstrate a boundary or limit
Tables
1 Periodic tests for maintenance of capability approval
Figures
1 Selection of CQCs
2 Test plan for photolithography process CQCs
3 Test plan for die bonding CQCs
4 Test plan for die bonding CQCs
5 Test plan for wire bonding and internal lead CQCs
6 Test plan for film thickness CQCs
7 Test plan for sealing of enclosure CQCs
8 Test plan for integrity of construction CQCs
9 Test plan for climate & acceleration CQCs
10 Test plan for humidity CQCs
11 Test plan for ageing CQCs
12 Test plan for solvent resistance CQCs
13 Test plan for free fall CQCs
14 Test plan for solderability CQCs
15 Test plan for resistance to soldering heat CQCs
16 Test plan for strength of terminals CQCs
17 Test plan for mould growth CQCs