Cooperating organizations
National foreword
Foreword
Preface
Section 1 - Scope
Section 2 - General
2.1 Order of precedence
2.2 Related documents
2.3 Units, symbols and terminology
2.4 Preferred ratings and characteristics
2.5 Marking
Section 3 - Quality assessment procedures
3.1 Primary stage of manufacture
3.2 Structurally similar components
3.3 Subcontracting
3.4 Incorporated components
3.5 Manufacturer's approval
3.6 Approval procedures
3.7 Procedures for capability approval
3.8 Procedures for qualification approval
3.9 Test procedures
3.10 Screening requirements
3.11 Rework and repair work
3.12 Certified test records
3.13 Validity of release
3.14 Release for delivery
3.15 Unchecked parameters
Section 4 - Test and measurement procedures
4.1 General
4.2 Test and measurement conditions
4.2.1 Standard conditions for testing
4.2.2 Equilibrium conditions
4.2.3 Air flow conditions for temperature tests
4.2.4 Power supplies
4.2.5 Precision of measurement
4.2.6 Precautions
4.2.7 Alternative test methods
4.3 Visual inspection
4.4 Dimensioning and gauging procedures
4.5 Electrical test procedures
4.5.1 Insulation resistance
4.5.2 Voltage proof
4.5.3 Input power
4.5.4 Output frequency
4.5.5 Frequency/temperature characteristics
4.5.6 Frequency/load coefficient
4.5.7 Frequency/voltage coefficient
4.5.8 Frequency stability with thermal transient
4.5.9 Startup time
4.5.10 Stabilization time
4.5.11 Frequency adjustment
4.5.12 Retrace characteristics
4.5.13 Oscillator output voltage (sinusoidal)
4.5.14 Oscillator output voltage (pulse waveform)
4.5.15 Oscillator output waveform (sinusoidal)
4.5.16 Oscillator output waveform (pulse)
4.5.17 Oscillator output power (sinusoidal)
4.5.18 Oscillator output impedance (sinusoidal)
4.5.19 Re-entrant isolation
4.5.20 Output suppression of gated oscillators
4.5.21 Tri-state output characteristics
4.5.22 Amplitude modulation characteristics
4.5.23 Frequency modulation characteristics
4.5.24 Spurious responses
4.5.25 Phase noise
4.5.26 Phase noise - vibration
4.5.27 Phase noise - acoustic
4.5.28 Noise pedestal
4.5.29 Spectral purity
4.5.30 Incidental frequency modulation
4.5.31 R.M.S. fractional frequency fluctuations
4.5.32 Electromagnetic interference (radiated)
4.6 Mechanical and environmental test procedures
4.6.1 Robustness of terminations
4.6.2 Sealing tests
4.6.3 Soldering (Solderability and resistance to
        solder heat)
4.6.4 Rapid change of temperature: severe shock by
        liquid immersion
4.6.5 Rapid change of temperature: thermal shock in
        air
4.6.6 Bump
4.6.7 Vibration
4.6.8 Shock
4.6.9 Free fall
4.6.10 Acceleration, steady state
4.6.11 Acceleration - 2g tip over
4.6.12 Acoustic noise
4.6.13 Low air pressure
4.6.14 Dry heat
4.6.15 Damp heat, cyclic
4.6.16 Cold
4.6.17 Climatic sequence
4.6.18 Damp heat steady state
4.6.19 Salt mist cyclic
4.6.20 Mould growth
4.6.21 Immersion in cleaning solvents
4.6.22 Radiation hardness
4.7 Endurance test procedure
4.7.1 Ageing
4.7.2 Extended ageing
4.7.3 Power consumption ageing
Annex
A Load circuit for logic drive
National annex NA (informative) Committees responsible
National annex NB (informative) Cross-references