Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages

Amendment of

BS EN 60191-4 : 2014

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

05-30-2018

Publisher

British Standards Institution

This part of IEC 60191 specifies a method for the designation of package outlines and for the lassification of forms of package outlines for semiconductor devices and a systematic method or generating universal descriptive designators for semiconductor device packages.

This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.

Committee	EPL/47
DocumentType	Amendment
Pages	42
PublisherName	British Standards Institution
Status	Current
Supersedes	BS EN 60191-4:2000