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BS EN 61188-5-6:2003

BS EN 61188-5-6:2003

Current

Current

The latest, up-to-date edition.

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

06-26-2003

Publisher

British Standards Institution

INTRODUCTION
1 Scope and object
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 QFJ (square)
  4.1 Introductory remark
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 QFJ (rectangular)
  5.1 Introductory remark
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography
Figures

Specifies information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

Committee
EPL/501
DevelopmentNote
Supersedes 95/208510 DC (07/2003)
DocumentType
Standard
Pages
22
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
NF EN 61188-5-6 : 2003 Identical
DIN EN 61188-5-6:2003-10 Identical
IEC 61188-5-6:2003 Identical
I.S. EN 61188-5-6:2003 Identical
EN 61188-5-6:2003 Identical

IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

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