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BS EN 62047-15:2015

BS EN 62047-15:2015

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Current

The latest, up-to-date edition.

Semiconductor devices. Micro-electromechanical devices Test method of bonding strength between PDMS and glass

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

07-31-2015

Publisher

British Standards Institution

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Explains test method for bonding strength between poly dimethyl siloxane (PDMS) and glass.

This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip.

Committee
EPL/47
DevelopmentNote
Supersedes 14/30217668 DC. (07/2015)
DocumentType
Standard
Pages
18
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 62047-15:2015 Identical
EN 62047-15:2015 Identical

IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

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Hardcopy - English
PDF - English
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