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BS EN 62258-5:2006

BS EN 62258-5:2006

Current

Current

The latest, up-to-date edition.

Semiconductor die products Requirements for information concerning electrical simulation

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

11-30-2006

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information on electrical simulation
  models
  5.1 Information on the electrical simulation model
  5.2 Information on device connectivity
  5.3 Information on the timing simulation model
  5.4 Information on connection redistribution
  5.5 Information on package terminals
Annex A (informative) Supporting information
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Describes the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.

IEC 62258-5:2006 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers;
- singulated bare die;
- die and wafers with attached connection structures;
- minimally or partially encapsulated die and wafers.
This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

This publication is to be read in conjunction with IEC 62258-1:2009 and IEC 62258-2:2011.

Committee
EPL/47
DevelopmentNote
Supersedes BS PD ES 59008-4.4 & 05/30139920 DC. (11/2006)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 62258-5:2006 Identical
EN 62258-5 : 2006 Identical
I.S. EN 62258-5:2006 Identical
NF EN 62258-5 : 2006 Identical
DIN EN 62258-5:2007-02 Identical
NBN EN 62258-5 : 2007 Identical

IEC 61691-1-1:2011 Behavioural languages - Part 1-1: VHDL Language Reference Manual
EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
IEC 62014-1:2001 Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2)
IEEE 1364-2005 IEEE Standard for Verilog Hardware Description Language
EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
IEC 61691-2:2001 Behavioural languages - Part 2: VHDL multilogic system for model interoperability
IEEE 1149.1-2013 REDLINE IEEE Standard for Test Access Port and Boundary-Scan Architecture

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