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BS EN ISO 9455-14:2017

Current
Current

The latest, up-to-date edition.

Soft soldering fluxes. Test methods Assessment of tackiness of flux residues
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

09-29-2017

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Principle
5 Reagents and materials
6 Apparatus
7 Test pieces
8 Procedure
9 Examination of the test piece
10 Expression of results
11 Test report

Defines a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. Pertains to all fluxes, solder pastes and flux cored solder wires.

This document specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Committee
EPL/501
DevelopmentNote
Supersedes 16/30337155 DC & BS EN 29455-14. (10/2017)
DocumentType
Standard
Pages
12
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN ISO 9455-14:2017 Identical
ISO 9455-14:2017 Identical

ISO 197-1:1983 Copper and copper alloys Terms and definitions Part 1: Materials
ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
ISO 9453:2014 Soft solder alloys Chemical compositions and forms

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