Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-25-2024

Publisher

British Standards Institution

This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type1 and type2 fluxes, as specified in ISO9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

Committee	EPL/501
DocumentType	Standard
Pages	30
PublisherName	British Standards Institution
Status	Current
Supersedes	BS EN ISO 9455-17:2006