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BS IEC 61182-2:2006

BS IEC 61182-2:2006

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements

Available format(s)

Hardcopy , PDF

Withdrawn date

02-28-2017

Language(s)

English

Published date

05-31-2007

Publisher

British Standards Institution

1 Scope and object
   1.1 Focus and intent
   1.2 Notation
2 Normative references
3 Documentation conventions
4 Requirements
   4.1 Rules concerning the use of XML and
        XML Schema
   4.2 Data organization and identification rules
   4.3 Transformation characteristics (Xform)
   4.4 Substitution groups
5 Content
   5.1 Content: FunctionMode
   5.2 Function levels
   5.3 Content: StepListRef
   5.4 Content: LayerDescRef
   5.5 Content: BomRef
   5.6 Content: AvlRef
   5.7 Content: DictionaryStandard
   5.8 Content: DictionaryUser
   5.9 Content: DictionaryFont
   5.10 Content: DictionaryLineDesc
   5.11 Content: DictionaryColor
   5.12 Content: DictionaryFirmware
6 Logistic header
   6.1 LogisticHeader
   6.2 Role
   6.3 Enterprise
   6.4 Person
7 History record
   7.1 HistoryRecord
   7.2 FileRevision
   7.3 SoftwarePackage
   7.4 ChangeRec
8 BOM (Material List)
   8.1 BOM Header
   8.2 BomItem
9 Electronic computer aided design (ecad)
   9.1 CadHeader
   9.2 CadData/LayerDesc
   9.3 CadData/StepList
10 Approved vendor list (AVL)
   10.1 AvlHeader
   10.2 AvlItem
11 Glossary
Annexe A (informative) IPC-7351 Naming Convention
        for Land Patterns
Annexe B - Informative references

Describes the XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.

Specifies the XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.

Committee
EPL/501
DevelopmentNote
Supersedes 03/318225 DC. (05/2007)
DocumentType
Standard
Pages
162
PublisherName
British Standards Institution
Status
Withdrawn

Standards Relationship
IEC 61182-2:2006 Identical

ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
IPC 2578 : 0 SECTIONAL REQUIREMENTS FOR SUPPLY CHAIN COMMUNICATION OF BILL OF MATERIAL AND PRODUCT DESIGN CONFIGURATION DATA - PRODUCT DATA EXCHANGE
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
ISO 10303-212:2001 Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation
ANSI Z210.1 : LATEST METRIC PRACTICE GUIDE
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC 2524 : 0 PWB FABRICATION DATA QUALITY RATING SYSTEM
IPC 2576 : 0 SECTIONAL REQUIREMENTS FOR ELECTRONICS MANUFACTURING SUPPLY CHAIN COMMUNICATION OF AS-BUILT PRODUCT DATA - PRODUCT DATA EXCHANGE (PDX)
IPC 2511 : B GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
IPC 2571 : 2001 GENERIC REQUIREMENTS FOR ELECTRONIC MANUFACTURING SUPPLY CHAIN COMMUNICATION - PRODUCT DATA EXCHANGE (PDX)
IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
IPC 2501 : 0 DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA
ISO 10303-210:2011 Industrial automation systems and integration Product data representation and exchange Part 210: Application protocol: Electronic assembly, interconnect, and packaging design
IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS

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