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PD IEC/TR 62258-8:2008

Current
Current

The latest, up-to-date edition.

Semiconductor die products EXPRESS model schema for data exchange
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

09-30-2008

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Data exchange
Annex A (normative) - EXPRESS model schema
Annex B (informative) - STEP physical file example

Assists the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers.

IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.

Committee
EPL/47
DevelopmentNote
Supersedes 06/30127629 DC. (10/2008)
DocumentType
Standard
Pages
28
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC TR 62258-8:2008 Identical

IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
ISO 10303-11:2004 Industrial automation systems and integration Product data representation and exchange Part 11: Description methods: The EXPRESS language reference manual
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
ISO 10303-21:2002 Industrial automation systems and integration Product data representation and exchange Part 21: Implementation methods: Clear text encoding of the exchange structure
IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

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