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CEI EN 60068-2-21 : 2006

CEI EN 60068-2-21 : 2006

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES

Available format(s)

Hardcopy , PDF

Superseded date

06-14-2022

Language(s)

English - Italian

Published date

01-01-2006

Publisher

Comitato Elettrotecnico Italiano

1 Scope
2 Normative references
3 Test Ua[1]: tensile
4 Test Ua[2]: thrust
5 Test Ub: bending
6 Test Uc: torsion
7 Test Ud: torque
8 Test Ue: robustness of
  terminations for SMD in
  the mounted state
Bibliography
Annex ZA (normative) - Normative
         references to international
         publications with their
         corresponding European
         publications

Defines to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations.

Committee
CT 309
DevelopmentNote
Classificazione CEI 91-40. (10/2006)
DocumentType
Standard
Pages
62
PublisherName
Comitato Elettrotecnico Italiano
Status
Superseded
SupersededBy

Standards Relationship
EN 60068-2-21:2006 Identical
IEC 60068-2-21:2006 Identical

ISO 272:1982 Fasteners — Hexagon products — Widths across flats
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60068-2-61:1991 Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 29453 : 1993 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS

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Hardcopy - English - Italian
PDF - English - Italian
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