CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1. SCOPE AND OBJECT
2. NORMATIVE REFERENCES
3. PREPARATIONS OF THE SPECIMEN
4. PROCEDURE
5. FINAL MEASUREMENT
6. REQUIREMENTS
7. DETAILS TO BE SPECIFIED
ANNEX ZA (NORMATIVE) - NORMATIVE REFERENCES TO
                       INTERNATIONAL PUBLICATIONS
                       WITH THEIR CORRESPONDING
                       EUROPEAN PUBLICATIONS

Describes the standard test method to access the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.

Committee	CT 48
DevelopmentNote	Classificazione CEI 48-71. (10/2002)
DocumentType	Standard
Pages	12
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
EN 60512-12-7:2001	Identical
IEC 60512-12-7:2001	Identical

HD 323.2.20 : 200S3	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
HD 323.2.54 : 200S1	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST TA: SOLDERING - SOLDERABILITY TESTING BY THE WETTING BALANCE METHOD

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CEI EN 60512-12-7 : 2002

CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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