CEI EN 61191-3 : 2018
Current
Current
The latest, up-to-date edition.
Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-24-2019
Publisher
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies.
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