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CEI EN 62047-15 : 2016

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

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withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS

Available format(s)

Hardcopy , PDF

Withdrawn date

05-16-2019

Language(s)

English

Published date

01-01-2016

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing method
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Specifies test method for bonding strength between poly dimethyl siloxane (PDMS) and glass.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-125. (08/2017)
DocumentType
Standard
Pages
18
PublisherName
Comitato Elettrotecnico Italiano
Status
Withdrawn
SupersededBy

Standards Relationship
IEC 62047-15:2015 Identical
EN 62047-15:2015 Identical

IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

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US$27.78
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