CEI EN IEC 60749-10:2022
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
12-01-2022
Publisher
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment.
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