Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2024

Publisher

Comitato Elettrotecnico Italiano

This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA).

Committee	CT 309
DocumentType	Test Method
ISBN	978-2-8322-7422-4
Pages	18
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
EN IEC 61189-2-804:2023	Identical
IEC 61189-2-804:2023	Identical

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CEI EN IEC 61189-2-804:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

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