FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Procedure of selecting the applicable
  test method
  4.1 Stress to solder joints in the field
      and test methods
  4.2 Selection of test methods based on
      the shapes and terminals of electronic
      components
5 Common subjects in each test method
  5.1 Mounting device and materials used
  5.2 Soldering condition
  5.3 Accelerated endurance test
  5.4 Selection of test conditions and
      analysis of test results
6 Test method
  6.1 Body strength test of SMD before
      and after the rapid temperature
      change test
  6.2 Cyclic bending strength test
  6.3 Mechanical shear fatigue test
  6.4 Cyclic drop test
  6.5 Strength test of leaded component
  6.6 Fillet lifting phenomenon observation
      of leaded component
Annex A (informative) - Condition of rapid temperature
                        change test
Annex B (informative) - Soldered joint test by electrical
                        conduction
Annex C (informative) - Torque shear strength test
Annex D (informative) - Monotonic bending strength test
Annex E (informative) - Cyclic steel ball drop strength test
Annex F (informative) - Pull strength test
Annex G (informative) - Creep strength test
Annex H (informative) - Fillet lifting phenomenon observation
                        of leaded component solder joint
                        and the life test by electrical
                        conduction