DD IEC/PAS 62596:2009

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
  3.1 Terms and definitions
  3.2 Abbreviations
4 Introduction to sampling
  4.1 Introductory remark
  4.2 Requirements and concerns for restricted substances
  4.3 Complexity of electrotechnical products and related
      challenges
  4.4 Strategies for sampling
5 Sampling
  5.1 Introductory remark
  5.2 Partial disassembly
      5.2.1 Example 1: Cell phone type A - Disassembly without
            tools
      5.2.2 Example 2: Cell phone type B - Partial disassembly
  5.3 Complete disassembly
  5.4 Partial disjointment
      5.4.1 Introductory remark
  5.5 Complete disjointment
      5.5.1 Introductory remark
      5.5.2 Typical examples of disjointment at the component
            level
      5.5.3 Examples of disjointment at the base materials
            level - Disjointment of integrated circuit (IC)
            chips
  5.6 Considerations of sampling and disjointment
      5.6.1 Introductory remark
      5.6.2 Sample size required
      5.6.3 Sample size v. detection limit
      5.6.4 Composite testing of disjointable samples
      5.6.5 Non-uniform "homogeneous materials"
      5.6.6 Determination of sampling position of homogeneous
            materials
6 Conclusions and recommendations
Annex A (informative) - Examples of procedures for sampling and
                        disjointment
Annex B (informative) - Probability of presence of restricted
                        substances
Annex C (informative) - Composite testing and sampling
Annex D (informative) - Tools used in sampling
Annex E (informative) - Use of XRF screening techniques in
                        sampling
Bibliography