MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2004

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
   4.1 Ball grid array package (BGA) Type 1 - Ball datum
   4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
   5.1 Datum S pertaining to ball coplanarity
   5.2 Datum A, B
   5.3 Definition of specified dimensions and measuring method
   5.4 Profile of a package edge surface v
   5.5 Mounting height A
   5.6 First stand-off A1
   5.7 Second stand-off A4
   5.8 Ball diameter b
   5.9 Ball center position X
   5.10 Ball coplanarity y
   5.11 Package top flatness y1
Annex ZA: Normative references to international publications
         with their corresponding European publications

Includes requirements for the measuring methods of ball grid array (BGA) dimensions.

DocumentType	Standard
Pages	20
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
EN 60191-6-4:2003	Identical
SN EN 60191-6-4 : 2003	Identical
IEC 60191-6-4:2003	Identical
I.S. EN 60191-6-4:2003	Identical
BS EN 60191-6-4:2003	Identical
NF EN 60191-6-4 : 2003	Identical
NBN EN 60191-6-4 : 2004	Identical