PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2008

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 TSOP (Type 1)
  4.1 Field of application
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 TSOP (Type 2)
  5.1 Field of application
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 SOP
  6.1 Field of application
  6.2 Component description
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 SSOP
  7.1 Field of application
  7.2 Component description
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides.

DevelopmentNote	Applies in conjunction with DIN EN 61188-5-1 (2003-06). (07/2008)
DocumentType	Standard
Pages	31
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
NF EN 61188-5-3 : 2016	Identical
EN 61188-5-3:2007	Identical
BS EN 61188-5-3:2007	Identical
I.S. EN 61188-5-3:2007	Identical
IEC 61188-5-3:2007	Identical